EN71PL032A0 Overview
Key Features
- 70 ns Package
- 7 x 9 x 1.2mm 56 ball FBGA Operating Temperature
- 25°C to +85°C
| Part | EN71PL032A0 |
|---|---|
| Description | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| Manufacturer | Elite Semiconductor Microelectronics Technology |
| Size | 418.81 KB |
Related Datasheets
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